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Product BOB-10859 | about 3 weeks ago

It has the thermal vias and a copper pad, but it’s definitely not as big as the TI recommendation.

• Add a second row of vias in the exposed pad.
• Don’t use thermals between the exposed pad and the rest of the topside ground pour.
• Push a few of the nearby traces out (on top and bottom side) to provide a little more copper for the thermal relief.

Quick mockup in Eagle:

• current design jpg
• thermally improved

Product TOL-10787 | about 10 months ago

They don’t specifically address it in the web site, but the MSDS says “Materials to avoid: Acids, bases, and oxidising agents”. http://sugru.com/pdfs/FORMEROLsugru_MSDS_Oct09.pdf

Product PRT-00138 | about 10 months ago

Original manufacturer data here: http://www.teko.it/en/prodotti/famiglia/PO/serie/68
Includes their drawing datasheet, a DWG and an eDrawing. Their drawing includes maximum PCB dimensions. The site also has a material datasheet in Italian (spoiler, it’s made of UL 94 rated ABS).