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KONNEKT high-density packaging technology features an innovative Transient Liquid Phase Sintering (TLPS) material that creates a surface-mount, multi-chip solution for high-density packaging. These capacitors are considered temperature stable due to the 125°C maximum operating temperature and are characterized as a Class II material by the Electronics Components, Assemblies, and Material Association (EIA). These X7R capacitors are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R boasts a minimal change in capacitance with reference to ambient temperature and the capacitance change is limited to ±15% from -55°C to +125°C.
KEMET KONNEKT X7R Auto Capacitors are ideal for applications where higher capacitance and voltage are needed without the need for additional board space. They are also suitable for use in industries related to automotive (hybrid), telecommunications, medical, military, aerospace, semiconductors, and test/diagnostic equipment. Also available are automotive-grade devices that meet AEC-Q200 requirements.