MG Chemicals SAC305 Lead-Free No-Clean Solder Paste

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MG Chemicals SAC305 Lead-Free No-Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver and copper metal powder combined with a no-clean flux to form a paste. This solder paste is designed for surface mount applications and provides high tack force and good wettability. Post-soldering residues are transparent, non-conductive, non-corrosive, and highly insulated. MG Chemicals SAC305 Lead-Free No-Clean Solder Paste is designed for use in high-speed printing, especially with SMT solder paste printers, with ultrafine stencils as small as 0.3mm.

  • 250g (8.81mL) Jar
  • Tin, silver, and copper mixture
  • Lead-free
  • No-clean
  • Non-corrosive
  • Non-conductive residue
  • Halide-free
  • Rosin flux
  • Suitable for ultra-fine pitch stencils as small as 0.3mm

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