×

Please see all COVID-19 updates here as some shipments may be delayed due to CDC safety and staffing guidelines. If you have an order or shipping question please refer to our Customer Support page. For technical questions please check out our Forums. Thank you for your continued support.

Member #101121

Member Since: January 3, 2010

Country: United States

  • Was reading some additional documentation on this chip (found using this search: AN-IVS-0002A-00) as well as reading though Kris Winer's various Q&A. It says the exposed die pad should NOT be soldered to the PCB. Kris refers to this as a big no-no. Is there something I'm missing here, because it looks like your breakout does put paste there for soldering (as well as running traces beneath the device, which also is discouraged)? I am asking because I bought a couple of these and I am having a very hard time calibrating them (wondering if this could be at least part of the issue).

No public wish lists :(