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Member #101121

Member Since: January 3, 2010

Country: United States

  • Was reading some additional documentation on this chip (found using this search: AN-IVS-0002A-00) as well as reading though Kris Winer’s various Q&A. It says the exposed die pad should NOT be soldered to the PCB. Kris refers to this as a big no-no. Is there something I’m missing here, because it looks like your breakout does put paste there for soldering (as well as running traces beneath the device, which also is discouraged)? I am asking because I bought a couple of these and I am having a very hard time calibrating them (wondering if this could be at least part of the issue).

No public wish lists :(