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Member Since: June 11, 2010

Country: United States

  • Fuming nitric works better to eat away that package. Also, the Xray pretty much showed the wirebonding/pads - so you know it’s not just a Cu slug. I would suggest saw/polish the die in half, then look under a microscope and see if you can spot the interconnects within the die. By the Xray, the pads are in a different orientation on the counterfeit. I’m guessing these are counterfeit, but pretty good ones. If you have access to FIB/DIB and SEM you could image some of the exposed silicon. Perhaps do some polish to get into the traces first?

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