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Member Since: September 7, 2010

Country: United States

  • you talked about serious problems with running mixed high temperature (usb ports) and low temperature (audio jack plastics) parts on the same board;
    in jewelry soldering, it is common to do the high temperature metals first, then the medium temp, then the low temp material. is it possible to do that with toaster reflow? run a batch of usb ports only, take it out, put all the other mid and low temp parts on? or does that not work because of your solder paste application technique?

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