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June 3, 2011
about 6 years ago
I looked up a similar formula on wikipedia and the melting point is 217-225 centigrade (Ag03A. Patented by AIM alliance.). The components and board soldered do not control the melting point of the solder, only the amount of power need to get to that melting point. Small components to tiny board, not much power. Large connector to big lug will take lots of wattage.
This solder is will make you take the components to a higher temperature to melt, possible damage to board or components, and may not be eutectic.
That means that rather than go from liquid to solid in a very small variation of temperature, as 63/37 lead solder does, it will be in a plastic state longer.This allows for the movement of the solder joint to create cold solder fractures, a cold solder joint. That is a bad connection characterized by a mottled or wrinkled appearance to cracks you can see in the solder joint. A good solder joint should be shiny.
Choose the lowest melting point solder to use and the smallest diameter. Small components with small holes = small diameter. Large lug connecting to large gauge wire or lead = large diameter solder.
You should have a special need to use exotic formulas of solder.
Hope this is helpful. :)
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