April 12, 2013
about 2 years ago
The junctions in TECs are of Fe strips soldered on the opposite ends of the semiconductor cubes and are held in place by the ceramic plates.
The Thermal expansion becomes a major factor when you try to maintain large temperature differences. The Junctions of cold side shrink and the junctions of hot side expand. The unit will suffer a mechanical failure way before T(hot) reaches the melting point of the semiconductor.
Since it’s a series of diodes by definition (mostly 127), a single failed junction renders the TEC unit useless.
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