July 17, 2008
News - Revisiting the Counterfei…
about 5 years ago
My guess is that the copper was to thermally enhance whatever was in the package. I doubt it is the “real deal”. Of course, why not just decap the part and look under a microscope. The atmel logo, copyright, and the die identification will be in the silicon.
It is a real part of some type, so I don’t think doing a contact or leakage test would yield much other than potentially identifying which pins are grounds.
No public wish lists :(
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