November 27, 2008
Tutorial - Nest Teardown
about 3 years ago
The underfill “bonded to the board” is for reliability. Lead free solder is brittle and the underfill distributes stresses across a larger area. This does not inhibit reverse engineering. It is easy enough to polish off the board and reball the chip for reverse engineering purposes.
This speaks to the build quality you referred to.
Not like the old days of 100mil 40pin DIP packages! But we would not have iPhones if we had to use old packaging technologies (instead we would call them iBricks).
about 6 years ago
This is an excellent mini-USB development board. Wonder why Microchip does not sell low cost development boards like this? With Microchip’s you have to buy an additional programmer.
No public wish lists :(
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