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- FLIR Lepton 2.5 - Thermal Imaging Module
The FLIR Lepton® 2.5 - Thermal Imaging Module is a radiometric-capable long wave infrared (LWIR) camera solution that is smaller than a dime, fits inside a smartphone, and is less expensive than traditional IR cameras. With a focal plane array of 80x60 active pixels, this Lepton easily integrates into native mobile-devices and other electronics as an IR sensor or thermal image sensor. The radiometric Lepton captures accurate, calibrated, and non-contact temperature data in every pixel.
For large quantities: We currently have a limit of one per customer order on the FLIR Lepton 2.5 module due to supply chain issues as a result of COVID-19. If you need to place a distributor order please contact your sales rep and they will assist you. For bulk order for this module please visit our Volume Pricing Page for inquiries of stock. At this time, we cannot guarantee orders for this module but we will do what we can to work with you in fulfilling your request.
- Effective Frame Rate: 8.6 Hz (commercial application exportable)
- Input Clock: 25-MHz nominal, CMOS IO Voltage Levels
- Output Format: User-selectable 14-bit, 8-bit (AGC applied), or 24-bit RGB (AGC and colorization applied)
- Pixel Size: 17 µm
- Radiometric Accuracy: High gain: Greater of +/- 5°C or 5% (typical) Low gain: Greater of +/- 10°C or 10% (typical)
- Scene Dynamic Range: -10-140 °C (high gain); up to 450°C (low gain) typical
- Spectral Range: Longwave infrared, 8 µm to 14 µm
- Temperature Compensation: Automatic. Output image independent of camera temperature.
- Thermal Sensitivity: <50 mK (0.050° C)
- Video Data Interface: Video over SPI
- Control Port: CCI (I2C-like), CMOS IO Voltage Levels
- Package Dimensions - Socket Version (w x l x h): 11.8 x 12.7 x 7.2 mm
- Mechanical Interface: 32–pin socket interface to standard Molex® socket
- Non-Operating Temperature Range: -40 °C to +80 °C
- Optimum Temperature Range: -10°C to +80°C
- Shock: 1500 G @ 0.4 ms
- Array format: 80 × 60, progressive scan
- FOV - Diagonal: 63.5°
- FOV - Horizontal: 50° (nominal)
- Image Optimization: Factory configured and fully automated
- Non-Uniformity Correction (NUC): Automatic with shutter
- Sensor Technology: Uncooled VOx microbolometer
- Solar protection: Integral
- Input Supply Voltage: 2.8 V, 1.2 V, 2.5 V to 3.1 V IO
- Power Dissipation: 150 mW (operating), 650 mW (during shutter event), 4 mW (standby)
FLIR Lepton 2.5 - Thermal Imaging Module Product Help and Resources
Core Skill: Programming
If a board needs code or communicates somehow, you're going to need to know how to program or interface with it. The programming skill is all about communication and code.
Skill Level: Competent - The toolchain for programming is a bit more complex and will examples may not be explicitly provided for you. You will be required to have a fundamental knowledge of programming and be required to provide your own code. You may need to modify existing libraries or code to work with your specific hardware. Sensor and hardware interfaces will be SPI or I2C.
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Core Skill: Electrical Prototyping
If it requires power, you need to know how much, what all the pins do, and how to hook it up. You may need to reference datasheets, schematics, and know the ins and outs of electronics.
Skill Level: Competent - You will be required to reference a datasheet or schematic to know how to use a component. Your knowledge of a datasheet will only require basic features like power requirements, pinouts, or communications type. Also, you may need a power supply that?s greater than 12V or more than 1A worth of current.
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