MG Chemicals 4860P Sn63/Pb37 Solder Paste No-Clean
TOL-20086
MG Chemicals 4860P Sn63/Pb37 Solder Paste No-Clean
SKU: TOL-20086
Out of stock
SKU
TOL-20086
This solder paste is designed for surface mount applications and provides high tack force and good wettability.
Product Overview
MG Chemicals 4860P Sn63/Pb37 No-Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. This solder paste is designed for surface mount applications and provides high tack force and good wettability. Post-soldering residues are transparent, non-conductive, non-corrosive, and highly insulated. MG Chemicals 4860P Sn63/Pb37 No-Clean Solder Paste is designed for use in high-speed printing, especially with SMT solder paste printers, with ultrafine stencils as small as 0.3mm.
Hookup Accessories
Features & Specs
- 250g (8.81mL) Jar
- 63/37 eutectic solder mixture
- No-clean
- Non-corrosive
- Non-conductive residue
- Halide-free
- Rosin flux
- Suitable for ultra-fine pitch stencils as small as 0.3mm
Documentation
Customer Reviews
MG Chemicals 4860P Sn63/Pb37 Solder Paste No-Clean
TOL-20086
Stock and Customer Discounts
$88.95 retail price.
Available Discounts
- $84.50 | 25+ units
- $80.06 | 100+ units