MG Chemicals SAC305 Lead-Free No-Clean Solder Paste
TOL-20085
MG Chemicals SAC305 Lead-Free No-Clean Solder Paste
SKU: TOL-20085
This solder paste is designed for surface mount applications and provides high tack force and good wettability.
Out of stock
SKU
TOL-20085
Product Overview
MG Chemicals SAC305 Lead-Free No-Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver and copper metal powder combined with a no-clean flux to form a paste. This solder paste is designed for surface mount applications and provides high tack force and good wettability. Post-soldering residues are transparent, non-conductive, non-corrosive, and highly insulated. MG Chemicals SAC305 Lead-Free No-Clean Solder Paste is designed for use in high-speed printing, especially with SMT solder paste printers, with ultrafine stencils as small as 0.3mm.
Similar Items
Hookup Accessories
Features & Specs
- 250g (8.81mL) Jar
- Tin, silver, and copper mixture
- Lead-free
- No-clean
- Non-corrosive
- Non-conductive residue
- Halide-free
- Rosin flux
- Suitable for ultra-fine pitch stencils as small as 0.3mm
Documentation
Customer Reviews
MG Chemicals SAC305 Lead-Free No-Clean Solder Paste
TOL-20085